Build-to-Print Electromechanical Assemblies & Systems for Mission-Critical Applications
We are Tier-2 Build-to-Print Contract Manufacture for complex, ruggedized electromechanical assemblies and systems. We specialize in low-volume prototyping and agile batch production, backed by 100% in-house functional, environmental, and mechanical validation.
Core Capabilities
Comprehensive production capabilities for complex, ruggedized electromechanical hardware.
Box Build Integration
Full system fabrication including enclosures, backplanes, power supplies, and internal routing.
Cable & Wire Harnessing
Custom interconnect solutions with automated stripping, crimping, and bundle management.
PCB Assembly (PCBA)
Integration of complex surface-mount and through-hole circuit boards into mechanical housings.
Precision Mechanical Assembly
Expert alignment of structural frames, brackets, and machined components.
Quality & Compliance Framework
Rigid compliance protocols governing workmanship, quality systems, traceability, and controlled workspaces.
IPC-A-620 Certified
Industry-standard workmanship for cable and wire harness assemblies.
- Standardized harness fabrication
- Calibrated crimp and pull verification
ISO 9001:2015 Registered
Strict adherence to international quality management protocols.
- Documented process flows
- Quality Assurance Plans (QAP)
Full Traceability
Component-level tracking from component intake to final product shipment.
- Batch and lot serialization
- Inspection and test records
Controlled Assembly Environments
Class 10K clean room and regulated workspaces to prevent ESD (Electrostatic Discharge) and foreign object debris (FOD)
Advanced Testing Solutions
Backed by 100% in-house functional, environmental, and mechanical validation.
In-House Verification Protocols
- Functional Validation: Simulated functional testing to verify full system performance.
- Environmental Stress Screening (ESS): Thermal ramp rate of 100C/min from -400C to +850C temperature range and Random Vibration Profile of 6g to10g RMS)
- Environmental Testing: Temperature range from -650C to +1500C, Humidity range of +400C, 95%RH, Salt Spray and Corrosion
- Mechanical Durability Testing: Multi-axis shaker tables executing sinusoidal and random vibration profiles, Shock and Bump tests
- Automated Optical Inspection (AOI): High-speed visual verification of component placement and solder integrity of PCBA
Supply Chain & Lifecycle Management
Strategic procurement, inventory buffering, and BOM optimization to support fluctuating production demands.
BOM Optimization
Alternate component sourcing suggestions to mitigate obsolescence risks.
- Obsolescence risk mitigation
- Form-fit-function alternatives
Global Procurement
Strong distributor networks ensuring cost-effective, high-quality component sourcing.
- Authorized distributor channels
- Cost-effective component procurement
Inventory Buffering
Kanban and safety-stock programs to support fluctuating production demands.
- Kanban inventory management
- Safety-stock programs
Submit Your Technical Data Package
Send your drawings, BOM, and assembly specifications for engineering review and quotation.